IP Library › Assignment 021487/0201
Patent Assignment
Reel/Frame 021487/0201

Assignment of Assignor's Interest

Recorded: 2008-08-29 Pages: 4
Assignor
VESEY, JEFF
Executed: 2008-07-30
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Property (1)
Small Pitch Ball Grid Array of a Package Assembly for Use with Conventional Burn-in Sockets
Patent: 7,705,619 →
Application: 12/156,971 →
Publication: US 2009/0079458
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 12, 2009
From: JIRJIS/KATO, YOUSIF
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 023092/0595 →
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →