Small pitch ball grid array of a package assembly for use with conventional burn-in sockets

1. A package assembly that electrically connects an integrated circuit to a substrate, the package assembly being selectively coupled to a burn-in apparatus during a burn-in process, the burn-in apparatus having a plurality of substantially evenly spaced apart contact members that are arranged at a first pitch, the package assembly comprising:

a pin-out including an array of contacts that are adapted to electrically communicate with the substrate, the array of contacts being arranged to include (i) a set of first contacts that are required for the burn-in process, the first contacts each being in contact with a corresponding contact member of the burn-in apparatus during the burn-in process, and (ii) a set of second contacts that are not required for the burn-in process, the second contacts not contacting any of the contact members of the burn-in apparatus during the burn-in process, the array of contacts being arranged at a second pitch that is smaller than the first pitch.

2. The package assembly of claim 1 wherein the second pitch is not greater than approximately 50 percent of the first pitch.

3. The package assembly of claim 2 wherein at least approximately 64 percent of all of the contacts are second contacts.

4. The package assembly of claim 1 wherein the second pitch is not greater than approximately 33⅓ percent of the first pitch.

5. The package assembly of claim 4 wherein at least approximately 81 percent of all of the contacts are second contacts.

6. The package assembly of claim 1 wherein the second pitch is not greater than approximately 0.50 millimeters.

7. The package assembly of claim 1 wherein the second pitch is not greater than approximately 0.33 millimeters.

8. The package assembly of claim 1 wherein the second pitch is not greater than approximately 0.25 millimeters.

9. The package assembly of claim 1 wherein the second pitch is less than 1.0 millimeters.

10. The package assembly of claim 1 wherein the first pitch is approximately 1.0 millimeters.

11. The package assembly of claim 1 wherein at least some of the first contacts are separated from one another by one second contact.

12. The package assembly of claim 1 wherein at least some of the first contacts are configured to enable a self-test of the package assembly during the burn-in process.

13. The package assembly of claim 12 wherein none of the second contacts is configured to enable a self-test of the package assembly during the burn-in process.

14. A package assembly that electrically connects an integrated circuit to a substrate, the package assembly being selectively coupled to a burn-in apparatus during a burn-in process, the burn-in apparatus having a plurality of substantially evenly spaced apart contact members that are arranged at a first pitch, the package assembly comprising:

a pin-out including an array of contacts that are adapted to electrically communicate with the substrate, the array of contacts being arranged at a second pitch that is smaller than the first pitch, the array of contacts including a set of first contacts that are required for the burn-in process and a set of second contacts that are not required for the burn-in process, the set of first contacts being arranged at a pitch that is at least twice as great as the second pitch;

wherein during the burn-in process each of the first contacts is in contact with a corresponding contact member of the burn-in apparatus and the second contacts do not contact any of the contact members of the burn-in apparatus.

15. The package assembly of claim 14 wherein the first pitch is approximately 1.0 millimeters.

16. The package assembly of claim 14 wherein the second pitch is not greater than approximately 0.50 millimeters.

17. The package assembly of claim 14 wherein the second pitch is not greater than approximately 0.25 millimeters.

18. The package assembly of claim 14 wherein the second pitch is not greater than approximately 50 percent of the first pitch.

19. The package assembly of claim 18 wherein at least approximately 64 percent of all of the contacts are second contacts.

20. The package assembly of claim 14 wherein the second pitch is less than 1.0 millimeters.

21. The package assembly of claim 14 wherein at least some of the first contacts are configured to enable a self-test of the package assembly during the burn-in process.

22. The package assembly of claim 21 wherein none of the second contacts is configured to enable a self-test of the package assembly during the burn-in process.

23. A method for manufacturing a package assembly of an integrated circuit package, comprising the step of:

providing an array of contacts of a pin-out on the package assembly, the array of contacts being adapted to electrically communicate with a substrate of the package assembly, the array of contacts including a plurality of first contacts that are required for a burn-in process with a burn-in apparatus and a plurality of second contacts that are not required for the burn-in process;

arranging each of the first contacts to be in contact with a corresponding contact member of the burn-in apparatus, the burn-in apparatus having a plurality of substantially evenly spaced apart contact members that are arranged at a first pitch that is greater than a second pitch of the array of contacts; and

arranging each of the second contacts not to be in contact with any contact members of the burn-in apparatus.

24. The method of claim 23 wherein the second pitch is not greater than approximately 50 percent of the first pitch.