IP Library › Assignment 021489/0108
Patent Assignment
Reel/Frame 021489/0108

Lien

Recorded: 2008-09-05 Received: 2008-09-05 Pages: 4
Assignor
NANONEXUS, INC.
Executed: 2008-09-05
Assignee
GLENN PATENT GROUP
3475 EDISON WAY, SUITE L, MENLO PARK, CA, 94025, UNITED STATES
Covered Properties (29)
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Application: 11/995,490 →
Massively Parallel Interface for Electronic Circuit
Application: 12/175,393 →
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/858,064 →
Systems for Testing and Packaging Integrated Circuits
Application: 11/781,172 →
Apparatus and Methods for Processing, Testing, and Packaging of Semiconductor Ics and Image Sensors
Fine Pitch Microfabricated Spring Contacts
Fine Pitch Microfabricated Spring Contact Structure & Method
Application: 11/692,138 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Application: 11/563,664 →
Miniaturized Contact Spring
Application: 11/556,134 →
Massively Parallel Interface for Electronic Circuit
Application: 11/555,603 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 11/552,110 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Application: 11/350,049 →
Massively Parallel Interface for Electronic Circuit
Application: 11/327,728 →
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/133,021 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/951,314 →
Enhanced Stress Metal Spring Contactor
Application: 10/932,552 →
Massively Parallel Interface for Electronic Circuit
Application: 10/918,511 →
Enhanced Compliant Probe Card Systems Having Improved Planarity
Application: 10/870,095 →
Method and Apparatus of Producing Uniform Isotropic Stresses in a Sputtered Film
Application: 10/487,652 →
Miniaturized Contact Spring
Application: 10/390,988 →
Miniaturized Contact Spring
Application: 10/390,994 →
Mosaic Decal Probe
Application: 10/196,494 →
Systems for Testing and Packaging Integrated Circuits
Application: 10/069,902 →
Construction Structures and Manufacturing Processes for Probe Card Assemblies and Packages Having Wafer Level Springs
Application: 10/178,103 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/094,370 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 09/980,040 →
Massively Parallel Interface for Electronic Circuits
Application: 09/979,551 →