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App. No. 10/094,370 · Confirmation No. 6868

CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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Quick Facts
App. No.
10/094,370
Filed
2002-03-08
Granted
2004-11-09
Pub. No.
US20040022042A1
Art Unit
2829
PTA
-151 days