IP Library › Assignment 024640/0301
Patent Assignment
Reel/Frame 024640/0301

Assignment of Assignor's Interest

Recorded: 2010-07-07 Received: 2010-07-07 Pages: 11
Assignor
Assignee
VERIGY (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, SGX, 768923, SINGAPORE
Covered Properties (65)
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Application: 12/525,051 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Application: 12/546,432 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 12/517,528 →
Transmission of Routes Between Client and Server Using Route Ids
Application: 12/416,920 →
Retrieval of Vehicular Traffic Information Optimized for Wireless Mobile Environments
Application: 12/416,812 →
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 12/354,520 →
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Application: 11/995,490 →
Generalization of Features in a Digital Map Using Round Number Coordinates
Application: 12/187,341 →
Massively Parallel Interface for Electronic Circuit
Application: 12/175,393 →
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Dynamically Configured Rendering of Digital Maps
Application: 11/865,720 →
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/858,064 →
Systems for Testing and Packaging Integrated Circuits
Application: 11/781,172 →
Apparatus and Methods for Processing, Testing, and Packaging of Semiconductor Ics and Image Sensors
Fine Pitch Microfabricated Spring Contacts
Fine Pitch Microfabricated Spring Contact Structure & Method
Application: 11/692,138 →
Fine Pitch Probe Card Having Rapid Fabrication Cycle
Application: 60/891,192 →
Draggable maps
Application: 11/706,065 →
Structures and processes for fabrication of probe card assemblies with multi-layer interconnect
Application: 60/898,964 →
High Precision Internet Local Search
Application: 11/608,791 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 60/868,535 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Application: 11/563,664 →
Miniaturized Contact Spring
Application: 11/556,134 →
Massively Parallel Interface for Electronic Circuit
Application: 11/555,603 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 11/552,110 →
Generalization of Features in a Digital Map
Application: 11/460,226 →
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Stress metal spring with interface stress decoupling layer
Application: 60/810,037 →
Radio Telecommunications Apparatus and Method for Communcations Internet Data Packets Containing Different Types of Data
Application: 10/550,009 →
Apparatus and methods for processing, testing, and packaging of semiconductor ICs and image sensors
Application: 60/797,886 →
Fine pitch microfabricated spring contacts
Application: 60/787,473 →
System and Method of Optimizing Database Queries in Two or More Dimensions
Application: 11/385,625 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Massively Parallel Interface for Electronic Circuit
Application: 11/327,728 →
Compliant nanocontactors for application in portable and high density electronic systems
Application: 60/718,137 →
Automated Prioritization of Map Objects
Application: 11/187,638 →
Method and apparatus for producing controlled stresses and stress gradients in sputtered films
Application: 60/699,647 →
High Density Interconnect System Having Rapid Fabrication Cycle
Nano-contactor embodiments for IC packages and interconnect components
Application: 60/651,294 →
Geocoding Locations Near a Specified City
Application: 11/018,566 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/951,314 →
Enhanced Stress Metal Spring Contactor
Application: 10/932,552 →
Massively Parallel Interface for Electronic Circuit
Application: 10/918,511 →
Probe card assembly with rapid fabrication cycle
Application: 60/592,908 →
Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
Application: 10/888,761 →
Enhanced Compliant Probe Card Systems Having Improved Planarity
Application: 10/870,095 →
Quick-change probe chip
Application: 60/573,541 →
Method and Apparatus of Producing Uniform Isotropic Stresses in a Sputtered Film
Application: 10/487,652 →
User Interface to Aid System Installation
Application: 10/726,982 →
Mosaic decal probe
Application: 10/717,813 →
Miniaturized Contact Spring
Application: 10/390,988 →
Miniaturized Contact Spring
Application: 10/390,994 →
System and Method of Optimizing Database Queries in Two or More Dimensions
Application: 10/278,126 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Mosaic Decal Probe
Application: 10/196,494 →
Systems for Testing and Packaging Integrated Circuits
Application: 10/069,902 →
Construction Structures and Manufacturing Processes for Probe Card Assemblies and Packages Having Wafer Level Springs
Application: 10/178,103 →
Nanosprings with increased resistance to failure
Application: 60/365,625 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/094,370 →
Managing and Querying Moving Point Data
Application: 10/012,367 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 09/980,040 →
Massively Parallel Interface for Electronic Circuits
Application: 09/979,551 →
Sputtering technique
Application: 60/314,776 →
Method and Apparatus for Location-Sensitive, Subsidized Cell Phone Billing
Application: 09/898,497 →