High density interconnect system for IC packages and interconnect assemblies
View Patent ↗An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.
1. An apparatus, comprising:
a structural element having a first surface for affixing at least one contactor scale package;
a connector structure comprising
a connector substrate having a connector surface and a second surface opposite the connector surface,
an array of at least one electrical connection located on the connector surface,
an array of electrical contacts located on the second surface, and
an array of at least one electrically conductive path extending from each of the electrical connections on the connector surface to a corresponding electrical contact of the array of electrical contacts on the second surface; and
a latchable interface for mechanically affixing the structural element to the connector structure;
wherein one or more contactor scale packages are locatable in a space defined between the first surface of the structural element and the connector surface of the connector structure, wherein the contactor scale packages comprise a contactor substrate having a contact surface and a mounting surface opposite the contact surface, and an array of at least one electrically conductive spring contact located on and extending from the contact surface, wherein the bonding surface of the contactor scale packages are affixable to the first surface of the structural element; and
wherein the array of electrical connections located on the connector surface correspond to the array of electrically conductive spring contacts.
2. The apparatus of claim 1 , wherein the structural element comprises any of a heat sink, a carrier, or a surface mount package substrate.
3. The apparatus of claim 1 , wherein the electrically conductive spring contacts comprise monolithically formed micro-fabricated stress metal spring contacts.
4. The apparatus of claim 1 , wherein the connector structure comprises any of ceramic, glass ceramic, glass, glass epoxy, FR-4, polyimide, silicon, a printed circuit board, one or more packaged ICs, or one or more flip chip ICs.
5. The apparatus of claim 1 , wherein the apparatus accommodates relative movement between the connector structure and the structural element.
6. The apparatus of claim 1 , further comprising:
one or more travel guides to guide relative movement between the connector structure and the structural element.
7. An apparatus, comprising:
a structural element having a first surface for affixing at least two contactor scale packages;
a connector structure comprising
a connector substrate having a connector surface and a second surface opposite the connector surface,
an array of at least one electrical connection located on the connector surface,
an array of electrical contacts located on the second surface, and
an array of at least one electrically conductive path extending from the connector surface to the second surface between the array of electrical connections and the array of electrical contacts;
a mechanism for accommodating relative movement between the connector structure and the structural element with respect to each other, wherein a space is defined between the first surface of the structural element and the connector surface of the connector structure; and
at least two contactor scale packages located in the space between the first surface of the structural element and the connector surface of the connector structure, wherein the contactor scale packages each comprise a contactor substrate having a contact surface and a mounting surface opposite the contact surface, and an array of at least one electrically conductive spring contact located on and extending from the contact surface, and wherein the mounting surface of the contactor scale packages are affixed to the first surface of the structural element;
wherein the array of electrical connections located on the connector surface correspond to the array of electrically conductive spring contacts; and
wherein the mechanism for accommodating relative movement between the connector structure and the structural element compensates for any differences in thicknesses of the contactor substrates between the contactor scale packages.
8. The apparatus of claim 7 , wherein the structural element comprises any of a heat sink, a carrier, or a surface mount package substrate.
9. The apparatus of claim 7 , wherein the electrically conductive spring contacts comprise monolithically formed micro-fabricated stress metal spring contacts.
10. The apparatus of claim 7 , wherein the connector structure comprises any of ceramic, glass ceramic, glass, glass epoxy, FR-4, polyimide, silicon, a printed circuit board, one or more packaged ICs, or one or more flip chip ICs.
11. The apparatus of claim 7 , further comprising:
a latch for mechanically affixing the structural element to the connector structure.
12. The apparatus of claim 7 , wherein the mechanism for accommodating relative movement between the connector structure and the structural element comprises one or more travel guides.