IP Library › Assignment 024640/0291
Patent Assignment
Reel/Frame 024640/0291

Assignment of Assignor's Interest

Recorded: 2010-07-07 Received: 2010-07-07 Pages: 10
Assignor
NANONEXUS, INC.
Executed: 2010-05-25
Assignee
NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, BUILDING A, MOUNTAIN VIEW, CA, 94043, UNITED STATES
Covered Properties (59)
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Application: 12/525,051 →
Block with Improved Central Mounting
Application: 12/720,467 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Application: 12/546,432 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 12/517,528 →
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 12/354,520 →
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Application: 11/995,490 →
Mast Track Extension and Pre-Feeder for Mainsail Furling
Application: 12/235,589 →
Block with Improved Central Mounting
Application: 12/210,935 →
Massively Parallel Interface for Electronic Circuit
Application: 12/175,393 →
Polymorphs of 7-[(3-Chloro-6,11-Dihydro-6-Methyldibenzo[C,F][1,2]Thiazepin-11-Yl)Amino]Heptanoic Acid S,S Dioxide and Methods of Making and Using the Same
Application: 12/041,747 →
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Quick Action Turnbuckle
Application: 11/964,176 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/858,064 →
Systems for Testing and Packaging Integrated Circuits
Application: 11/781,172 →
Apparatus and Methods for Processing, Testing, and Packaging of Semiconductor Ics and Image Sensors
Fine Pitch Microfabricated Spring Contacts
Fine Pitch Microfabricated Spring Contact Structure & Method
Application: 11/692,138 →
Fine Pitch Probe Card Having Rapid Fabrication Cycle
Application: 60/891,192 →
Structures and processes for fabrication of probe card assemblies with multi-layer interconnect
Application: 60/898,964 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 60/868,535 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Application: 11/563,664 →
Miniaturized Contact Spring
Application: 11/556,134 →
Massively Parallel Interface for Electronic Circuit
Application: 11/555,603 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 11/552,110 →
Arrangement for Lifting and Lowering Objects
Application: 11/491,108 →
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Stress metal spring with interface stress decoupling layer
Application: 60/810,037 →
Apparatus and methods for processing, testing, and packaging of semiconductor ICs and image sensors
Application: 60/797,886 →
Fine pitch microfabricated spring contacts
Application: 60/787,473 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Method and Apparatus for Compacting Sail Cars
Application: 11/346,523 →
Massively Parallel Interface for Electronic Circuit
Application: 11/327,728 →
Compliant nanocontactors for application in portable and high density electronic systems
Application: 60/718,137 →
Method and apparatus for producing controlled stresses and stress gradients in sputtered films
Application: 60/699,647 →
High Density Interconnect System Having Rapid Fabrication Cycle
Nano-contactor embodiments for IC packages and interconnect components
Application: 60/651,294 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/951,314 →
Enhanced Stress Metal Spring Contactor
Application: 10/932,552 →
Massively Parallel Interface for Electronic Circuit
Application: 10/918,511 →
Probe card assembly with rapid fabrication cycle
Application: 60/592,908 →
Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
Application: 10/888,761 →
Enhanced Compliant Probe Card Systems Having Improved Planarity
Application: 10/870,095 →
Quick-change probe chip
Application: 60/573,541 →
Method and Apparatus of Producing Uniform Isotropic Stresses in a Sputtered Film
Application: 10/487,652 →
Mosaic decal probe
Application: 10/717,813 →
Miniaturized Contact Spring
Application: 10/390,988 →
Miniaturized Contact Spring
Application: 10/390,994 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Fairlead and Cam Assembly
Application: 10/224,180 →
Mosaic Decal Probe
Application: 10/196,494 →
Systems for Testing and Packaging Integrated Circuits
Application: 10/069,902 →
Construction Structures and Manufacturing Processes for Probe Card Assemblies and Packages Having Wafer Level Springs
Application: 10/178,103 →
Nanosprings with increased resistance to failure
Application: 60/365,625 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/094,370 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 09/980,040 →
Massively Parallel Interface for Electronic Circuits
Application: 09/979,551 →
Sputtering technique
Application: 60/314,776 →
Lifting Device
Application: 09/757,796 →