Patent Application
Provisional
Small
App. No. 60/810,037
· Confirmation No. 6664
Stress metal spring with interface stress decoupling layer
Provisional Application Expired
Inventors
Fu Chiung Chong
Saratoga, CA
Pierre H. Giauque
San Francisco, CA
Roman Milter
San Francisco, CA
Thomas Edward Dinan
San Jose, CA
Erh-Kong Chieh
Cupertino, CA
David Thanh Doan
San Jose, CA
Douglas N. Modlin
Palo Alto, CA
W.R. Bottoms
Palo Alto, CA
Attorneys & Agents of Record
Prosecution
- Confirmation No.
- 6664
from
NANONEXUS, INC.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-07-07
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-07-07
from
BOTTOMS, W. R.,
CHONG, FU CHIUNG,
DINAN, THOMAS EDWARD,
DOAN, DAVID THANH,
GIAUQUE, PIERRE H.,
MODLIN, DOUGLAS N.,
CHIEH, ERH-KONG,
MILTER, ROMAN
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2006-07-26
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Quick Facts
- App. No.
- 60/810,037
- Filed
- 2006-05-31
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