IP Library › Patent Application 60898964
Patent Application Provisional Small
App. No. 60/898,964 · Confirmation No. 6487

Structures and processes for fabrication of probe card assemblies with multi-layer interconnect

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2007-03-06 APP.FILE.REC Filing Receipt 3 View
2007-01-31 TRNA Transmittal of New Application 3 View
2007-01-31 SPEC Specification 5 View
2007-01-31 DRW Drawings-only black and white line drawings 5 View
2007-01-31 WFEE Fee Worksheet (SB06) 1 View
2007-01-31 APPENDIX Appendix to the specification 312 View
2007-01-31 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/898,964
Filed
2007-01-31