IP Library › Assignment 022024/0219
Patent Assignment
Reel/Frame 022024/0219

Lien Release

Recorded: 2008-12-23 Received: 2008-12-23 Pages: 4
Assignor
GLENN PATENT GROUP
Executed: 2008-12-23
Assignee
NANONEXUS, INC.
P.O. BOX 640100, SAN JOSE, CA, 95164, UNITED STATES
Covered Properties (30)
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
Application: 11/995,490 →
Massively Parallel Interface for Electronic Circuit
Application: 12/175,393 →
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/858,064 →
Systems for Testing and Packaging Integrated Circuits
Application: 11/781,172 →
Apparatus and Methods for Processing, Testing, and Packaging of Semiconductor Ics and Image Sensors
Fine Pitch Microfabricated Spring Contacts
Fine Pitch Microfabricated Spring Contact Structure & Method
Application: 11/692,138 →
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
Application: 11/563,664 →
Miniaturized Contact Spring
Application: 11/556,134 →
Massively Parallel Interface for Electronic Circuit
Application: 11/555,603 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 11/552,110 →
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Application: 11/350,049 →
Massively Parallel Interface for Electronic Circuit
Application: 11/327,728 →
High Density Interconnect System Having Rapid Fabrication Cycle
Application: 11/133,021 →
Fluorene-Based Compound and Organic Electroluminescent Display Device Using the Same
Application: 11/097,182 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/951,314 →
Enhanced Stress Metal Spring Contactor
Application: 10/932,552 →
Massively Parallel Interface for Electronic Circuit
Application: 10/918,511 →
Enhanced Compliant Probe Card Systems Having Improved Planarity
Application: 10/870,095 →
Method and Apparatus of Producing Uniform Isotropic Stresses in a Sputtered Film
Application: 10/487,652 →
Miniaturized Contact Spring
Application: 10/390,988 →
Miniaturized Contact Spring
Application: 10/390,994 →
Mosaic Decal Probe
Application: 10/196,494 →
Systems for Testing and Packaging Integrated Circuits
Application: 10/069,902 →
Construction Structures and Manufacturing Processes for Probe Card Assemblies and Packages Having Wafer Level Springs
Application: 10/178,103 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 10/094,370 →
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 09/980,040 →
Massively Parallel Interface for Electronic Circuits
Application: 09/979,551 →