Patent Assignment
Reel/Frame 021508/0894
Assignment of Assignor's Interest
Recorded: 2008-09-10
Pages: 7
Assignors
CHANG, SHOU-ZEN
Executed: 2008-03-18
YU, HONGYU
Executed: 2008-03-19
VELOSO, ANABELA
Executed: 2008-03-18
VOS, RITA
Executed: 2008-03-18
KUBICEK, STEFAN
Executed: 2008-03-18
BIESEMANS, SERGE
Executed: 2008-03-18
SINGANAMALLA, RAGHUNATH
Executed: 2008-04-10
LAUWERS, ANNE
Executed: 2008-05-18
ONSIA, BART
Executed: 2008-03-10
Assignees
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN ROAD 6, HSINCHU, 300-077, TAIWAN
Covered Property
(1)
Methods for manufacturing a CMOS device with dual dielectric layers
Application:
11/972,601 →
Publication:
US 2008/0191286
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 4, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
To: IMEC
Reel/Frame 023594/0846 →
Assignment of Assignor's Interest
May 10, 2012
From: IMEC; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: IMEC; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.; KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
Reel/Frame 028186/0647 →