Patent Assignment
Reel/Frame 028186/0647
Assignment of Assignor's Interest
Recorded: 2012-05-10
Pages: 6
Assignors
IMEC
Executed: 2012-01-16
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-04-20
Assignees
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN ROAD 6, HSINCHU, 300-077, TAIWAN
KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
WAAISTRAAT 6, BOX 5105, LEUVEN, 3000, BELGIUM
Covered Property
(1)
Methods for manufacturing a CMOS device with dual dielectric layers
Application:
11/972,601 →
Publication:
US 2008/0191286
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2008
From: CHANG, SHOU-ZEN; YU, HONGYU; VELOSO, ANABELA; VOS, RITA
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC); TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021508/0894 →
Change of Name
Dec 4, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
To: IMEC
Reel/Frame 023594/0846 →