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Patent Assignment
Reel/Frame 021511/0047

Merger

Recorded: 2008-09-11 Pages: 11
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Assignor
ASE MATERIAL INC.
Executed: 2004-09-03
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAO-HSIUNG CITY, TAIWAN
Covered Property (1)
Method of Making Multilayer Substrate
Patent: 6,555,016 →
Application: 09/749,666 →
Publication: US 2002/0084244
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 12, 2003
From: LAI, KUEI-YU
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.; ASE MATERIAL INC.
Reel/Frame 013840/0052 →
Assignment of Assignor's Interest Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →