IP Library › Assignment 021518/0063
Patent Assignment
Reel/Frame 021518/0063

Assignment of Assignor's Interest

Recorded: 2008-09-11 Pages: 4
Assignor
Assignee
ASE (SHANGHAI) INC.
2300 KIN KE ROAD,ZHANGJIANG HI-TECH PARK, SHANGHAI, CHINA
Covered Properties (10)
Wire Structure of Substrate for Layout Detection
Patent: 6,313,413 →
Application: 09/414,584 →
Method of Making Multilayer Substrate
Patent: 6,555,016 →
Application: 09/749,666 →
Publication: US 2002/0084244
Method of Drilling a Circuit Substrate
Patent: 6,754,951 →
Application: 09/920,543 →
Publication: US 2002/0035785
Packaging Substrate with Electrostatic Discharge Protection
Patent: 6,700,077 →
Application: 10/164,356 →
Publication: US 2002/0185305
Flip Chip Package Substrate
Patent: 6,714,421 →
Application: 10/249,369 →
Publication: US 2004/0026797
Substrate Strip with Sides Having Flanges and Recesses
Patent: 6,828,002 →
Application: 10/268,478 →
Publication: US 2003/0072913
Packaging Substrate with Electrostatic Discharge Protection
Patent: 6,828,664 →
Application: 10/282,422 →
Publication: US 2003/0091673
Packaging Substrate with Electrostatic Discharge Protection
Patent: 6,777,793 →
Application: 10/289,852 →
Publication: US 2003/0090861
Substrate with Reinforced Contact Pad Structure
Patent: 7,005,750 →
Application: 10/902,003 →
Publication: US 2005/0023679
Fabrication Method for Printed Circuit Board
Patent: 7,384,566 →
Application: 11/121,091 →
Publication: US 2005/0246892
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 8, 1999
From: CHEN, KUN-CHING; LEE, YIRE-ZINE; YEH, YUNG-I; TAO, SU
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 010317/0578 →
Assignment of Assignor's Interest Jul 31, 2001
From: HO, SHENG-CHUN; HSIAO, MIN-LIANG
To: ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.; ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 012644/0476 →
Assignment of Assignor's Interest Mar 28, 2002
From: HO, SHENG-CHUN; HSIAO, MIN-LIANG
To: ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.; ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 012765/0054 →
Assignment of Assignor's Interest Jul 30, 2002
From: CHIANG, JUANG-SHENG
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 013143/0207 →
Assignment of Assignor's Interest Oct 10, 2002
From: CHOU, KUANG-CHUN; CHENG, WIN-CHI
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 013384/0769 →
Assignment of Assignor's Interest Oct 29, 2002
From: HUANG, CHIH-PIN; LEE, YUNG-CHI
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 013440/0924 →
Assignment of Assignor's Interest Nov 7, 2002
From: LEE, MENG-TSANG; LO, KUANG-LIN
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 013477/0743 →
Assignment of Assignor's Interest Mar 12, 2003
From: LAI, KUEI-YU
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.; ASE MATERIAL INC.
Reel/Frame 013840/0052 →
Assignment of Assignor's Interest Apr 3, 2003
From: CHEN, KUN-CHING; TONG, HO-MING; LEE, CHUN-CHI
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 013535/0200 →
Assignment of Assignor's Interest Jul 30, 2004
From: LIU, SHENG-TSUNG
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 015641/0807 →
Assignment of Assignor's Interest May 4, 2005
From: CHEN, HUNG-NAN; FANG, JEN-KUANG; LO, KUANG-LIN
To: ADVANCED SEMICONDUCTOR ENGINEERING INC.
Reel/Frame 016531/0285 →
Merger Sep 11, 2008
From: ASE MATERIAL INC.
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 021511/0047 →
Merger Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 021511/0062 →