IP Library Assignment 013440/0924
Patent Assignment
Reel/Frame 013440/0924

Assignment of Assignor's Interest

Recorded: 2002-10-29 Pages: 4
Assignors
HUANG, CHIH-PIN
Executed: 2002-10-24
LEE, YUNG-CHI
Executed: 2002-10-24
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZ EXPORT PROCESSING ZONE, KAOSHIUNG, KAOSHIUNG, R.O.C., TAIWAN
Covered Property (1)
Packaging Substrate with Electrostatic Discharge Protection
Patent: 6,828,664 →
Application: 10/282,422 →
Publication: US 2003/0091673
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →