IP Library Assignment 015641/0807
Patent Assignment
Reel/Frame 015641/0807

Assignment of Assignor's Interest

Recorded: 2004-07-30 Pages: 2
Assignor
LIU, SHENG-TSUNG
Executed: 2004-07-07
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property (1)
Substrate with Reinforced Contact Pad Structure
Patent: 7,005,750 →
Application: 10/902,003 →
Publication: US 2005/0023679
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →