IP Library › Assignment 013535/0200
Patent Assignment
Reel/Frame 013535/0200

Assignment of Assignor's Interest

Recorded: 2003-04-03 Pages: 3
Assignors
CHEN, KUN-CHING
Executed: 2002-08-22
TONG, HO-MING
Executed: 2002-08-14
LEE, CHUN-CHI
Executed: 2002-08-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property (1)
Flip Chip Package Substrate
Patent: 6,714,421 →
Application: 10/249,369 →
Publication: US 2004/0026797
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →