Patent Assignment
Reel/Frame 021511/0062
Merger
Recorded: 2008-09-11
Pages: 11
Assignor
ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.
Executed: 2004-09-03
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAO-HSIUNG CITY, TAIWAN
Covered Property
(1)
Method of Drilling a Circuit Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 31, 2001
From: HO, SHENG-CHUN; HSIAO, MIN-LIANG
To: ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.; ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 012644/0476 →
Assignment of Assignor's Interest
Mar 28, 2002
From: HO, SHENG-CHUN; HSIAO, MIN-LIANG
To: ADVANCED SEMICONDUCTOR ENGINEERING MATERIAL, INC.; ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 012765/0054 →
Assignment of Assignor's Interest
Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →