IP Library Assignment 013477/0743
Patent Assignment
Reel/Frame 013477/0743

Assignment of Assignor's Interest

Recorded: 2002-11-07 Pages: 4
Assignors
LEE, MENG-TSANG
Executed: 2002-11-06
LO, KUANG-LIN
Executed: 2002-11-06
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE KAOSHIUNG, KAOSHIUNG, TAIWAN
Covered Property (1)
Packaging Substrate with Electrostatic Discharge Protection
Patent: 6,777,793 →
Application: 10/289,852 →
Publication: US 2003/0090861
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2008
From: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
To: ASE (SHANGHAI) INC.
Reel/Frame 021518/0063 →