Assignment of Assignor's Interest

Recorded: 2008-09-18 Pages: 2

Assignor

HONDA, HIROKAZU

Executed: 2007-01-05

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Method of Manufacturing Interconnect Substrate and Semiconductor Device

Application: 12/212,690 →

Publication: US 2009/0017613

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.