Patent Assignment
Reel/Frame 021564/0466
Assignment of Assignor's Interest
Recorded: 2008-09-09
Pages: 3
Assignor
TAKAO, NORIYUKI
Executed: 2008-08-29
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, NAKAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor device having silicon-on-insulator (SOI) structure and method of forming semiconductor device
Application:
12/232,006 →
Publication:
US 2009/0085150
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.