IP Library › Assignment 021588/0068
Patent Assignment
Reel/Frame 021588/0068

Assignment of Assignor's Interest

Recorded: 2008-09-25 Pages: 3
Assignor
MARCOUX, PHIL P., MR.
Executed: 2008-09-25
Assignee
CHIPSCALE, INC.
20400 STEVENS CREEK BLVD., SUITE 500, I. P. LEGAL, CUPERTINO, CALIFORNIA, 95014
Covered Property (1)
Semiconductor with Bottom-Side Wrap-Around Flange Contact
Patent: 7,858,512 →
Application: 12/147,375 →
Publication: US 2009/0321930
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2009
From: CHIPSCALE, INC.
To: WAFER-LEVEL PACKAGING PORTFOLIO LLC
Reel/Frame 022142/0718 →
Assignment of Assignor's Interest Jun 21, 2012
From: MARCOUX, PHIL P.; LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED LLC; WAFER-LEVEL PACKAGING PORTFOLIO LLC
To: MARCOUX, PHIL P.
Reel/Frame 028417/0789 →
Assignment of Assignor's Interest Sep 6, 2012
From: MARCOUX, PHIL
To: CHIP SYSTEMS INNOVATIONS, LLC
Reel/Frame 028911/0296 →