IP Library › Assignment 022142/0718
Patent Assignment
Reel/Frame 022142/0718

Assignment of Assignor's Interest

Recorded: 2009-01-22 Pages: 6
Assignor
CHIPSCALE, INC.
Executed: 2009-01-22
Assignee
WAFER-LEVEL PACKAGING PORTFOLIO LLC
20400 STEVENS CREEK BLVD., 5TH FLOOR, I. P. LEGAL, CUPERTINO, CALIFORNIA, 95014
Covered Properties (4)
Semiconductor with Top-Side Wrap-Around Flange Contact
Semiconductor with Bottom-Side Wrap-Around Flange Contact
Semiconductor with Top-Side Wrap-Around Flange Contact
Application: 12/147,370 →
Publication: US 2009/0324906
Semiconductor with Bottom-Side Wrap-Around Flange Contact
Patent: 7,858,512 →
Application: 12/147,375 →
Publication: US 2009/0321930
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 25, 2008
From: MARCOUX, PHIL P., MR.
To: CHIPSCALE, INC.
Reel/Frame 021588/0068 →
Assignment of Assignor's Interest Sep 25, 2008
From: MARCOUX, PHIL P., MR.
To: CHIPSCALE, INC.
Reel/Frame 021588/0088 →
Assignment of Assignor's Interest Jun 21, 2012
From: MARCOUX, PHIL P.; LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED LLC; WAFER-LEVEL PACKAGING PORTFOLIO LLC
To: MARCOUX, PHIL P.
Reel/Frame 028417/0789 →
Assignment of Assignor's Interest Sep 6, 2012
From: MARCOUX, PHIL
To: CHIP SYSTEMS INNOVATIONS, LLC
Reel/Frame 028911/0296 →