Patent Assignment
Reel/Frame 021589/0887
Assignment of Assignor's Interest
Recorded: 2008-09-19
Pages: 5
Assignors
HAYASHIDA, AKIRA
Executed: 2008-08-28
UENO, MASAAKI
Executed: 2008-08-28
SHIMADA, MASAKAZU
Executed: 2008-08-28
KITAMURA, KIMIO
Executed: 2008-08-18
TANAKA, KENJI
Executed: 2008-08-18
NISHIHARA, JYUNICHI
Executed: 2008-08-22
Assignees
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
TEITOKUSHA CO., LTD.
1-5-32, SHIGITA, JOTO-KU, OSAKA-SHI, OSAKA, 536-0015, JAPAN
Covered Property
(1)
Heating Apparatus, Substrate Processing Apparatus Employing the Same, Method of Manufacturing Semiconductor Devices, and Extending Member
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.