Patent Assignment
Reel/Frame 021592/0539
Assignment of Assignor's Interest
Recorded: 2008-09-19
Pages: 6
Assignors
HAYASHIDA, AKIRA
Executed: 2008-08-28
UENO, MASAAKI
Executed: 2008-08-28
SHIMADA, MASAKAZU
Executed: 2008-08-28
SUGISHITA, MASASHI
Executed: 2008-08-28
MIYATA, TOSHIMITSU
Executed: 2008-08-29
KITAMURA, KIMIO
Executed: 2008-08-18
TANAKA, KENJI
Executed: 2008-08-18
NISHIHARA, JYUNICHI
Executed: 2008-08-22
Assignees
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO, 101-8980, JAPAN
TEITOKUSHA CO., LTD.
1-5-32, SHIGITA, JOTO-KU, OSAKA-SHI, OSAKA, 536-0015, JAPAN
Covered Property
(1)
Heating Apparatus, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.