Patent Assignment
Reel/Frame 021609/0134
Assignment of Assignor's Interest
Recorded: 2008-09-30
Pages: 6
Assignors
JANG3, WOO JIN
Executed: 2008-09-29
CHO, SUNG DONG
Executed: 2008-09-29
KIM, HYUNG WOO
Executed: 2008-09-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTON-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Electrical Interconnects Using Electroless Plating Techniques That Inhibit Void Formation
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of Assignor's Name Woo Jin JANG3 and the Spelling of Assignee's Address Yeongton-Gu Previously Recorded on Reel 021609 Frame 0134. Assignor(S) Hereby Confirms the Assignor's Name to Be Woo Jin Jang and Assignee's Address to Be Yeongtong-Gu.
Oct 1, 2008
From: JANG, WOO JIN; CHO, SUNG DONG; KIM, HYUNG WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 021613/0353 →
Assignment of Assignor's Interest
Oct 29, 2008
From: MOON, BUM KI
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 021752/0250 →
Assignment of Assignor's Interest
Oct 30, 2008
From: INFINEN TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 021760/0760 →