IP Library › Assignment 021752/0250
Patent Assignment
Reel/Frame 021752/0250

Assignment of Assignor's Interest

Recorded: 2008-10-29 Pages: 2
Assignor
MOON, BUM KI
Executed: 2008-10-22
Assignee
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
640 N. MCCARTHY BLVD., MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Methods of Forming Electrical Interconnects Using Electroless Plating Techniques That Inhibit Void Formation
Patent: 7,879,720 →
Application: 12/241,744 →
Publication: US 2010/0081272
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2008
From: JANG3, WOO JIN; CHO, SUNG DONG; KIM, HYUNG WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 021609/0134 →
Corrective Assignment to Correct the Spelling of Assignor's Name Woo Jin JANG3 and the Spelling of Assignee's Address Yeongton-Gu Previously Recorded on Reel 021609 Frame 0134. Assignor(S) Hereby Confirms the Assignor's Name to Be Woo Jin Jang and Assignee's Address to Be Yeongtong-Gu. Oct 1, 2008
From: JANG, WOO JIN; CHO, SUNG DONG; KIM, HYUNG WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 021613/0353 →
Assignment of Assignor's Interest Oct 30, 2008
From: INFINEN TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 021760/0760 →