Patent Assignment
Reel/Frame 021736/0596
Assignment of Assignor's Interest
Recorded: 2008-10-24
Pages: 2
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Diffusion Barrier and Adhesion Layer for an Interconnect Structure