IP Library Assignment 021753/0874
Patent Assignment
Reel/Frame 021753/0874

Assignment of Assignor's Interest

Recorded: 2008-10-29 Pages: 2
Assignor
YAMADA, TOMOYUKI
Executed: 2008-10-20
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Substrate Processing Method
Patent: 8,112,183 →
Application: 12/260,211 →
Publication: US 2009/0192652
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →