Patent Assignment
Reel/Frame 021760/0627
Assignment of Assignor's Interest
Recorded: 2008-10-30
Pages: 3
Assignor
SUH, MIN SUK
Executed: 2008-10-15
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate for Semiconductor Package and Semiconductor Package Having the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.