IP Library Assignment 030613/0753
Patent Assignment
Reel/Frame 030613/0753

Change of Name

Recorded: 2013-06-14 Pages: 48
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2012-03-23
Assignee
SK HYNIX INC.
2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Substrate for Semiconductor Package and Semiconductor Package Having the Same
Patent: 8,299,582 →
Application: 12/261,156 →
Publication: US 2010/0052109
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 30, 2008
From: SUH, MIN SUK
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 021760/0627 →
Assignment of Assignor's Interest May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →