Substrate for semiconductor package and semiconductor package having the same
View Patent ↗A semiconductor package includes a substrate including a substrate body having a first face and a second face opposing the first face. A first through electrode passes through the substrate body between the first face and the second face. An insulation member is disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member is electrically connected to the first through electrode, and a second conductive unit electrically connected to the first conductive unit is exposed at side faces of the insulation member. A semiconductor chip having third and fourth faces is disposed over the first face of the substrate body in a vertical direction. A second through electrode passes through the substrate body between the third and fourth faces and is electrically connected to the second conductive unit.
1. A substrate for a semiconductor package, comprising:
a substrate body having a first face and a second face opposing the first face; a through electrode passing through the semiconductor body between the first face and the second face;
an insulation member disposed on the first face; and a connection member comprising:
a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode; and
a second conductive unit electrically connected to the first conductive member and exposed at a side face of the insulation member, and
wherein the second conductive unit is directly exposed,
wherein the insulation member comprises a first insulation unit and a second insulation unit disposed on the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit, and
wherein the insulation member and the substrate body are separate and distinct from each other.
2. The substrate for a semiconductor package according to claim 1 , wherein the substrate body comprises a semiconductor chip having a circuit unit and a bonding pad electrically connected to the through electrode.
3. The substrate for a semiconductor package according to claim 1 , wherein the substrate body comprises a printed circuit board.
4. The substrate for a semiconductor package according to claim 3 , wherein the substrate body comprises at least one of a transistor, a diode, a resistor, and an inductor.
5. The substrate for a semiconductor package according to claim 1 , further comprising:
a conductive ball disposed on the second face of the substrate body and electrically connected to the through electrode.
6. The substrate for a semiconductor package according to claim 1 , further comprising:
a connection member disposed on the portion of the second conductive.
7. The substrate for a semiconductor package according to claim 1 ,
wherein the first conductive unit extends through a portion of the insulation member in a direction perpendicular to the first face and the second conductive unit is disposed parallel to the first face.
8. The substrate for a semiconductor package according to claim 1 , wherein:
the insulation member has a block shape,
the first conductive unit extends through a portion of the insulation member in a direction substantially perpendicular to the first face,
the second conductive unit extends through the insulation member in a direction parallel to the first face such that the second conductive unit is exposed at two side faces of the insulation member opposite to each other.
9. A substrate for a semiconductor package, comprising:
a substrate body having a first face and a second face opposing the first face, wherein the substrate body comprises a semiconductor chip having a circuit unit and a bonding pad electrically connected to the through electrode;
a through electrode passing through the substrate body between the first face and the second face;
an insulation member disposed on the first face; and
a connection member comprising:
a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode; and
a second conductive unit electrically connected to the first conductive unit and directly exposed at a side face and an opposing side face of the side face of the insulation member, and
wherein the insulation member and the substrate body are separate and distinct from each other.
10. The substrate for a semiconductor package according to claim 9 , further comprising: a conductive ball disposed on the second face of the substrate body and electrically connected to the through electrode.
11. The substrate for a semiconductor package according to claim 9 , further comprising: an additional connection member disposed on the portion of the second conductive unit exposed at the side face of the insulation member.
12. The substrate for a semiconductor package according to claim 9 , wherein: the insulation member comprises a first insulation unit and a second insulation unit disposed on the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit.
13. The substrate for a semiconductor package according to claim 9 , wherein the first conductive unit extends through a portion of the insulation member in a direction vertical to the first face and the second conductive unit is disposed parallel to the first face.
14. The substrate for a semiconductor package according to claim 9 , wherein: the insulation member has a block shape, the first conductive unit extends through a portion of the insulation member in a direction substantially vertical to the first face, the second conductive unit extends through the insulation member in a direction parallel to the first face such that the second conductive unit is directly exposed at the side face and the opposing side face of the side face of the insulation member opposite to each other.
15. A substrate for a semiconductor package, comprising:
a substrate body having a first face and a second face opposing the first face, wherein the substrate body comprises a semiconductor chip having a circuit unit and a bonding pad electrically connected to the through electrode;
a through electrode passing through the substrate body between the first face and the second face;
an insulation member disposed on the first face; and
a connection member comprising:
a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode; and
a second conductive unit electrically connected to the first conductive unit and directly exposed at a side face and an opposing side face of the side face of the insulation member, wherein the insulation member comprises a first insulation unit and a second insulation unit disposed on the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit.
16. The substrate for a semiconductor package according to claim 15 , further comprising: a conductive ball disposed on the second face of the substrate body and electrically connected to the through electrode.
17. The substrate for a semiconductor package according to claim 15 , further comprising: an additional connection member disposed on the portion of the second conductive unit directly exposed at the side face and the opposing side face of the side face of the insulation member.
18. The substrate for a semiconductor package according to claim 15 , wherein the first conductive unit extends through a portion of the insulation member in a direction vertical to the first face and the second conductive unit is disposed parallel to the first face.
19. The substrate for a semiconductor package according to claim 15 , wherein: the insulation member has a block shape, the first conductive unit extends through a portion of the insulation member in a direction substantially vertical to the first face, the second conductive unit extends through the insulation member in a direction parallel to the first face such that the second conductive unit is directly exposed at the side face and the opposing side face of the side face of the insulation member opposite to each other.