IP Library Assignment 021799/0442
Patent Assignment
Reel/Frame 021799/0442

Assignment of Assignor's Interest

Recorded: 2008-11-06 Pages: 6
Assignors
JONES, CHRISTOPHER C.
Executed: 2008-05-15
BACH, DAVID
Executed: 2006-12-05
LITT, TIMOTHE
Executed: 2006-12-05
BINDER, LARRY
Executed: 2006-12-05
RADHAKRISHNAN, KALADHAR
Executed: 2008-05-15
PALANDUZ, CENGIZ A.
Executed: 2006-12-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Ceramic Package Substrate with Recessed Device
Patent: 8,264,846 →
Application: 11/611,063 →
Publication: US 2008/0142961
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 20, 2008
From: JONES, CHRISTOPHER C.; BACH, DAVID; LITT, TIMOTHE; BINDER, LARRY
To: INTEL CORPORATION
Reel/Frame 021419/0098 →