Patent Assignment
Reel/Frame 021801/0726
Assignment of Assignor's Interest
Recorded: 2008-11-07
Pages: 3
Assignor
KIM, DONG JOON
Executed: 2005-03-02
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Method of Forming Metal Wiring of Semiconductor Device
Patent:
41,653 →
Application:
12/284,848 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest
Aug 12, 2013
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 030988/0419 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →