Patent Assignment
Reel/Frame 021812/0667
Assignment of Assignor's Interest
Recorded: 2008-11-10
Pages: 3
Assignee
HONDA MOTOR CO., LTD.
1-1, MINAMI-AOYAMA 2-CHOME, MINATO-KU, TOKYO, 107-8556, JAPAN
Covered Property
(1)
Semiconductor Device Having an Increased Area of One of the Opposing Electrode Parts for Preventing Generation of Unconnected Positions the Electrodes on the Bonded Wafers