Patent Assignment
Reel/Frame 021819/0871
Assignment of Assignor's Interest
Recorded: 2008-11-12
Pages: 8
Assignors
SRINIVASAN, GOVINDARAJAN T.
Executed: 2008-09-29
HAMBLIN, MICHAEL W.
Executed: 2008-10-06
WRINN, JOSEPH F.
Executed: 2008-09-30
REICHERT, PETER A.
Executed: 2008-09-29
Assignee
TERADYNE, INC.
600 RIVERPARK DRIVE (MS NR 700-2-3), NORTH READING, MASSACHUSETTS, 01864
Covered Property
(1)
X-Ray Inspection of Solder Reflow in High-Density Printed Circuit Board Applications
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Grant of Security Interest in Patents
Dec 3, 2008
From: TERADYNE, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0762 →
Release of Security Interest
May 13, 2009
From: BANK OF AMERICA, N.A.
To: TERADYNE, INC
Reel/Frame 022668/0750 →
Patent Security Agreement
Apr 27, 2015
From: TERADYNE, INC.; LITEPOINT CORPORATION
To: BARCLAYS BANK PLC
Reel/Frame 035507/0116 →
Release of Security Interest in Intellectual Property
Jun 28, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: TERADYNE, INC.; EAGLE TEST SYSTEMS, INC.; LITEPOINT CORPORATION; NEXTEST SYSTEMS CORPORATION
Reel/Frame 049632/0940 →
Security Interest
May 7, 2020
From: TERADYNE, INC.
To: TRUIST BANK
Reel/Frame 052595/0632 →