Patent Assignment
Reel/Frame 021825/0105
Assignment of Assignor's Interest
Recorded: 2008-11-12
Pages: 3
Assignor
STROTHMANN, THOMAS
Executed: 2008-11-06
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Under Bump Metallization Structure Having a Seed Layer for Electroless Nickel Deposition
Application:
12/142,415 →
Publication:
US 2009/0057909
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.