Assignment of Assignor's Interest

Recorded: 2008-10-28 Pages: 3

Assignor

OZAWA, KEN

Executed: 2008-10-01

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor chip and semiconductor device with chip internal circuit element having component(s) both inside and outside of the chip seal ring

Application: 12/289,452 →

Publication: US 2009/0121322

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.