Merger

Recorded: 2008-11-18 Received: 2008-11-18 Pages: 13

Assignor

ALTEC LANSING TECHNOLOGIES, INC.

Executed: 2006-10-30

Assignee

PLANTRONICS, INC.

345 ENCINAL STREET, SANTA CRUZ, CA, 95060, UNITED STATES

Covered Properties (14)

Redistribution Layer for Wafer-Level Chip Scale Package and Method Therefor

Application: 12/090,686 →

Portable audio reproduction system

Application: 11/505,863 →

Integrated audio speaker surround

Application: 11/431,917 →

Ferrofluid Magnetic Seal

Application: 11/416,192 →

Portable Media Player Emulator for Facilitating Wireless Use of an Accessory

Application: 11/412,101 →

Digital Power Link Audio Distribution System and Components Thereof

Application: 11/373,505 →

Mountable Speaker Assembly

Application: 11/288,450 →

Adapting Device for a Portable Device

Application: 11/143,948 →

Portable media reproduction system

Application: 11/244,928 →

Angularly adjustable speaker system

Application: 11/218,117 →

Portable media reproduction system

Application: 11/143,945 →

Control panel door for a speaker

Application: 11/143,944 →

Stand System with Integrated Electrical Plug for Portable Electronic Devices

Application: 11/106,720 →

Dipole and Monopole Surround Sound Speaker System

Application: 10/956,095 →