Patent Assignment
Reel/Frame 021917/0865
Assignment of Assignor's Interest
Recorded: 2008-11-25
Pages: 4
Assignors
NAKAGAWA, TAKASHI
Executed: 2008-11-04
TATSUMI, TORU
Executed: 2008-11-04
OSHIDA, MAKIKO
Executed: 2008-11-04
IKARASHI, NOBUYUKI
Executed: 2008-11-04
TAKAHASHI, KENSUKE
Executed: 2008-11-04
MANABE, KENZO
Executed: 2008-11-04
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Formation Method of Metallic Compound Layer, Manufacturing Method of Semiconductor Device, and Formation Apparatus for Metallic Compound Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 11, 2010
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024524/0463 →
Change of Name
Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0687 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →