IP Library › Assignment 021949/0688
Patent Assignment
Reel/Frame 021949/0688

Assignment of Assignor's Interest

Recorded: 2008-12-09 Pages: 2
Assignor
ZU, LONGQIANG
Executed: 2008-12-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Method and Structure for Adapting Solder Column to Warped Substrate
Patent: 8,152,048 →
Application: 12/331,154 →
Publication: US 2010/0143656
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Please Correct the Receiving Party Data to Add Global Unichip Corp. Previously Recorded on Reel 021949 Frame 0688. Assignor(S) Hereby Confirms the Assignment. Apr 8, 2010
From: ZU, LONGQIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.; GLOBAL UNICHIP CORP.
Reel/Frame 024205/0041 →