IP Library › Assignment 024205/0041
Patent Assignment
Reel/Frame 024205/0041

Corrective Assignment to Correct the Please Correct the Receiving Party Data to Add Global Unichip Corp. Previously Recorded on Reel 021949 Frame 0688. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2010-04-08 Pages: 4
Assignor
ZU, LONGQIANG
Executed: 2009-02-19
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
GLOBAL UNICHIP CORP.
NO. 10, LI-HSIN 6TH ROAD, HSINCHU SCIENCE PARK, HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Method and Structure for Adapting Solder Column to Warped Substrate
Patent: 8,152,048 →
Application: 12/331,154 →
Publication: US 2010/0143656
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: ZU, LONGQIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021949/0688 →