Assignment of Assignor's Interest

Recorded: 2008-12-23 Pages: 3

Assignor

IZUMI, SHIGETO

Executed: 2008-12-18

Assignee

NIKON CORPORATION

2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN

Covered Property (1)

Wafer Bonding Apparatus

Patent: 8,206,525 →

Application: 12/306,445 →

Publication: US 2009/0317960

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.