IP Library › Assignment 073611/0008
Patent Assignment
Reel/Frame 073611/0008

Assignment of Assignor's Interest

Recorded: 2025-11-18 Pages: 4
Assignor
NIKON CORPORATION
Executed: 2025-10-02
Assignee
SCREEN HOLDINGS CO., LTD.
TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI, KYOTO, 602-8585, JAPAN
Covered Properties (27)
Wafer Bonding Apparatus
Patent: 8,206,525 →
Application: 12/306,445 →
Publication: US 2009/0317960
Transport Method and Transport Apparatus
Patent: 8,244,399 →
Application: 12/644,615 →
Publication: US 2010/0168908
Substrate Bonding Apparatus and Substrate Bonding Method
Patent: 8,454,771 →
Application: 12/703,714 →
Publication: US 2010/0139836
Alignment Apparatus, Substrates Stacking Apparatus, Stacked Substrates Manufacturing Apparatus, Exposure Apparatus and Alignment Method
Patent: 8,964,190 →
Application: 12/704,946 →
Publication: US 2010/0231928
Substrate Bonding Apparatus
Patent: 9,015,930 →
Application: 12/769,218 →
Publication: US 2010/0206454
Design System for Semiconductor Device, Method for Manufacturing Semiconductor Device, Semiconductor Device and Method for Bonding Substrates
Patent: 8,370,789 →
Application: 12/879,826 →
Publication: US 2011/0202890
Wafer Bonding Apparatus
Patent: 8,794,287 →
Application: 13/482,067 →
Publication: US 2012/0234454
Pair of Substrate Holders, Substrate Holder, Substrate Bonding Apparatus and Method for Manufacturing Device
Patent: 8,863,808 →
Application: 13/524,820 →
Publication: US 2013/0008581
Transport Method and Transport Apparatus
Patent: 8,489,227 →
Application: 13/548,287 →
Publication: US 2012/0330459
Substrate Separating Apparatus, Load Lock Apparatus, Substrate Bonding Apparatus, Substrate Separating Method, and Manufacturing Method of a Semiconductor Apparatus
Patent: 8,932,432 →
Application: 13/594,151 →
Publication: US 2013/0048222
Design System for Semiconductor Device, Method for Manufacturing Semiconductor Device, Semiconductor Device and Method for Bonding Substrates
Patent: 8,856,722 →
Application: 13/732,796 →
Publication: US 2013/0191806
Multi-Layered Substrate Manufacturing Method
Application: 13/761,348 →
Publication: US 2013/0157438
Substrate Bonding Apparatus and Substrate Bonding Method
Patent: 9,299,620 →
Application: 13/887,496 →
Publication: US 2013/0244350
Substrate Bonding Apparatus, Substrate Holding Apparatus, Substrate Bonding Method, Substrate Holding Method, Multilayered Semiconductor Device, and Multilayered Substrate
Patent: 9,539,800 →
Application: 14/062,988 →
Publication: US 2014/0072774
Wafer Bonding System and Method
Application: 14/519,831 →
Publication: US 2015/0122414
System and Method for Clamping Wafers Together in Alignment Using Pressure
Patent: 9,947,637 →
Application: 14/519,838 →
Publication: US 2015/0122412
Substrate Aligning Apparatus, Substrate Bonding Apparatus, Substrate Aligning Method and Substrate Bonding Method
Patent: 9,919,508 →
Application: 14/695,621 →
Publication: US 2015/0231873
Apparatus for Stacking Substrates and Method for the Same
Application: 15/618,615 →
Publication: US 2017/0278803
Substrate Bonding Apparatus and Substrate Bonding Method
Application: 16/019,923 →
Publication: US 2018/0308770
Substrate Bonding Apparatus and Substrate Bonding Method
Application: 16/144,439 →
Publication: US 2019/0043826
Stacking Apparatus and Stacking Method
Application: 16/220,356 →
Publication: US 2019/0122915
Stacked Substrate Manufacturing Method, Stacked Substrate Manufacturing Apparatus, Stacked Substrate Manufacturing System, and Substrate Processing Apparatus
Application: 16/244,729 →
Publication: US 2019/0148184
Bonding Method, Bonding Device, and Holding Member
Application: 16/413,127 →
Publication: US 2019/0267238
Stacking Apparatus and Stacking Method
Application: 17/037,033 →
Publication: US 2021/0028045
Bonding Method, Bonding Device, and Holding Member
Application: 17/225,727 →
Publication: US 2021/0225651
Substrate Bonding Apparatus and Substrate Bonding Method
Application: 17/453,734 →
Publication: US 2022/0084870
Apparatus for Stacking Substrates and Method for the Same
Application: 17/455,611 →
Publication: US 2022/0148978
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2008
From: IZUMI, SHIGETO
To: NIKON CORPORATION
Reel/Frame 022025/0252 →
Assignment of Assignor's Interest Feb 12, 2010
From: HORIKOSHI, TAKAHIRO
To: NIKON CORPORATION
Reel/Frame 023932/0601 →
Assignment of Assignor's Interest Mar 12, 2010
From: MAEDA, HIDEHIRO; OKAMOTO, KAZUYA; TANAKA, YASUAKI
To: NIKON CORPORATION
Reel/Frame 024074/0120 →
Assignment of Assignor's Interest Apr 28, 2010
From: MAEDA, HIDEHIRO; KATAGIRI, SATOSHI
To: NIKON CORPORATION
Reel/Frame 024302/0986 →
Assignment of Assignor's Interest Jun 28, 2010
From: TANAKA, YASUAKI; SANADA, SATORU
To: NIKON CORPORATION
Reel/Frame 024605/0103 →
Assignment of Assignor's Interest May 2, 2011
From: SUGAYA, ISAO; HORIKOSHI, TAKAHIRO; OKAMOTO, KAZUYA
To: NIKON CORPORATION
Reel/Frame 026210/0647 →
Assignment of Assignor's Interest Sep 25, 2012
From: YUKI, DAISUKE; MIIKE, TAKAHIRO; MORI, HIROSHI
To: NIKON CORPORATION
Reel/Frame 029022/0204 →
Assignment of Assignor's Interest Nov 8, 2012
From: TANAKA, KEIICHI; YOSHIHASHI, MASAHIRO
To: NIKON CORPORATION
Reel/Frame 029267/0029 →
Assignment of Assignor's Interest Nov 26, 2013
From: KITO, YOSHIAKI; SHIRASU, HIROSHI; YOSHIHASHI, MASAHIRO; YUKI, DAISUKE
To: NIKON CORPORATION
Reel/Frame 031674/0845 →
Assignment of Assignor's Interest Oct 21, 2014
From: PHILLIPS, ALTON H.; HASHEMI, FARDAD A.
To: NIKON CORPORATION
Reel/Frame 033995/0962 →
Assignment of Assignor's Interest Oct 21, 2014
From: PHILLIPS, ALTON H.
To: NIKON CORPORATION
Reel/Frame 033995/0596 →
Assignment of Assignor's Interest Apr 27, 2015
From: OKAMOTO, KAZUYA; SUGAYA, ISAO
To: NIKON CORPORATION
Reel/Frame 035499/0660 →
Assignment of Assignor's Interest Aug 9, 2019
From: MITSUISHI, HAJIME; SUGAYA, ISAO; FUKUDA, MINORU; TSUNODA, MASAKI
To: NIKON CORPORATION
Reel/Frame 050017/0072 →