Assignment of Assignor's Interest

Recorded: 2015-04-27 Pages: 2

Assignors

OKAMOTO, KAZUYA

Executed: 2015-04-21

SUGAYA, ISAO

Executed: 2015-04-20

Assignee

NIKON CORPORATION

12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN

Covered Property (1)

Substrate Aligning Apparatus, Substrate Bonding Apparatus, Substrate Aligning Method and Substrate Bonding Method

Patent: 9,919,508 →

Application: 14/695,621 →

Publication: US 2015/0231873

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.