Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device
A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.
1. A device comprising:
a first substrate holder;
a second substrate holder, wherein a first substrate bonded to a second substrate are held between the first substrate holder and the second substrate holder;
a holding section included in at least one of the first substrate holder and the second substrate holder that holds via adhesion one of the first substrate and the second substrate;
a pressure receiving portion included proximate the holding section in the first substrate holder that receives a force causing separation of the first substrate holder from the second substrate holder; and
a control section that delivers force to the pressure receiving portion via a pressing member when the adhesion to the one of the first substrate and the second substrate is deactivated.
2. The device according to claim 1 , further comprising:
a passing portion included in the second substrate holder which allows a pressing member to press the pressure receiving portion to deliver the force.
3. The device according to claim 2 , wherein the second substrate holder includes a second holding portion for holding the second substrate, and the passing portion is formed in a portion other than the second holding portion.
4. The device according to claim 2 , wherein the pressure receiving portion of the first substrate holder has a greater radius than a the passing portion of the second substrate holder.
5. The device according to claim 2 , wherein the radius of the first substrate holder at the pressure receiving portion differs from the radius of the second substrate holder at the passing portion.
6. The device according to claim 2 , wherein the passing portion is a notch formed in an outer circumferential portion of the second substrate holder.
7. The device according to claim 6 , wherein the second substrate holder has a circular shape, and the notch extends in a circumferential direction of the second substrate holder.
8. The device according to claim 7 , wherein the notch extends in the circumferential direction by a length that is from 6% to 27% of a radius of the circular shape, and extends in a radial direction by a length that is from 3% to 25% of the radius of the circular shape.
9. The device according to claim 1 , wherein the first substrate holder includes a first holding portion for holding the first substrate, and the pressure receiving portion is provided in a portion of the first substrate holder other than the first holding portion.
10. The device according to claim 1 , further comprising:
a bonding section that bonds the first substrate to the second substrate; and
a separating section that separates the bonded first substrate and second substrate from both the first substrate holder and the second substrate holder.
11. The device according to claim 10 , further comprising:
a preliminary aligner that aligns the first substrate with respect to a first reference portion provided on the first substrate holder and aligns the second substrate with respect to a second reference portion provided on the second substrate holder;
a transport mechanism that transports the first substrate holder holding the first substrate aligned by the preliminary aligner and the second substrate holder holding the second substrate aligned by the preliminary aligner from the preliminary aligner; and
an observing unit that observes the first and second reference portions of the first substrate holder and the second substrate holder during the transport by the transport mechanism.
12. The device according to claim 11 , further comprising
an aligner that aligns and stacks the first substrate held by the first substrate holder and the second substrate held by the second substrate holder based on a skew amount between the reference portions according to the preliminary aligner and the observation by the observing unit;
wherein a transport path of the transport mechanism includes at least a portion of a path from the preliminary aligner to the aligner.
13. The device according to claim 12 , wherein the aligner includes:
a first stage on which is loaded the first substrate holder;
a second stage that moves relative to the first stage and on which is loaded the second substrate holder; and
a control section that corrects a target position of one of the first stage and the second stage based on the skew amount.
14. The device according to claim 12 , further comprising
an inverting mechanism that inverts an orientation of one of the first substrate holder and the second substrate holder, between the preliminary aligner and the aligner,
wherein the observing unit is arranged between the inverting mechanism and the aligner.
15. The device according to claim 11 , wherein an image capturing field of view of the observing unit is narrower than an image capturing field of view of the preliminary aligner.
16. The device according to claim 11 , wherein each reference portion is a notch formed in an outer circumferential portion of each of the first substrate holder and the second substrate holder.
17. The device according to claim 16 , wherein each notch is machined to have a tip that is thinner than the substrate holders.
18. A substrate holder comprising:
a holding portion that holds via adhesion one of a first substrate and a second substrate bonded to the first substrate;
a passing portion included proximate the holding portion that allows a pressing member to pass therethrough to enable pressing of a complimentary substrate holder by the pressing member; and
a control section that delivers force to the complimentary substrate holder via the pressing member when the adhesion to the one of the first substrate and the second substrate is deactivated.
19. The substrate holder according to claim 18 , wherein the passing portion is formed in a portion other than the holding portion.
20. The substrate holder according to claim 18 , further comprising an outer circumferential portion, wherein the passing portion is a notch formed in the outer circumferential portion.
21. The substrate holder according to claim 20 , wherein the outer circumferential portion has a circular shape, and the notch extends in a circumferential direction of the circumferential portion.
22. The substrate holder according to claim 21 , wherein the notch extends in the circumferential direction by a length that is from 6% to 27% of a radius of the circular shape, and extends in a radial direction by a length that is from 3% to 25% of the radius of the circular shape.
23. A substrate holder comprising
a holding section that holds via adhesion one of a first substrate and a second substrate bonded to the first substrate;
a pressure receiving portion proximate the holding section that receives a force in a direction causing movement away from a complimentary substrate holder; and
a control section that delivers force to the pressure receiving portion via a pressing member when the adhesion to the one of the first substrate and the second substrate is deactivated.
24. A method comprising:
bonding a first substrate held by a first holding portion of a first substrate holder via adhesion to a second substrate held by a second holding portion of a second substrate holder via adhesion;
deactivating the adhesion to the first substrate;
delivering force to a pressure receiving portion of a first substrate holder via a pressing member when the adhesion to the first substrate is deactivated, the pressure receiving portion proximate the first holding portion; and
separating the bonded first substrate and second substrate from the first substrate holder.
25. The method according to claim 24 , further comprising:
aligning, with a preliminary aligner, the first substrate with respect to a first reference portion provided on the first substrate holder and the second substrate with respect to a second reference portion provided on the second substrate holder;
transporting the first substrate holder holding the aligned first substrate and the second substrate holder holding the aligned second substrate from the preliminary aligner; and
observing the first and second reference portions of the first substrate holder and the second substrate holder during the transport.
26. The method according to claim 25 , further comprising
aligning with an aligner, the first substrate held by the first substrate holder and the second substrate held by the second substrate holder; and
stacking the first substrate on the second substrate based on a skew amount between positions of the reference portions according to the preliminary aligner and the observed positions of the reference portions;
wherein a path used for the transportation includes at least a portion of a path from the preliminary aligner to the aligner.
27. The method according to claim 26 , wherein the stacking includes correcting a target position of a movable stage, on which is mounted one of the first substrate holder and the second substrate holder, based on the skew amount.
28. The method according to claim 26 , further comprising
inverting an orientation of one of the first substrate holder and the second substrate holder, at a point in time between the preliminary alignment and the stacking,
wherein the observing takes place at a point in time between the inverting and the stacking.
29. The manufacturing method according to claim 24 , wherein the separating includes pressing a pressure receiving portion of a first substrate with a pressing member.
30. The manufacturing method according to claim 29 , wherein the pressing is performed once an electrostatic adhesion of the holding member has dissipated.
31. The manufacturing method according to claim 29 , wherein the separating further includes:
retracting the pressing member;
holding the first substrate with the first substrate holder;
releasing the second substrate from the second substrate holder; and
pressing the pressure receiving portion with the pressing member.