Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate
Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate. In the above-described substrate bonding apparatus, while the first substrate is not held by the holder, the deformer may deform the holder from a first state to a second state that is more deformed than the first state, and while the first substrate is held by the holder, the deformer may reduce the amount of the deformation of the holder to less than the amount of the deformation of the second state to deform the first substrate.
1. A substrate bonding apparatus comprising:
a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
a deformer operable to bend at least a first substrate of the two substrates in order to deform the first substrate in accordance with the calculated amount of misalignment between the two substrates; and
a bonder operable to bond the first substrate in which the misalignment is corrected based on deformation by the deformer to a second substrate of the two substrates.
2. The substrate bonding apparatus as set forth in claim 1 , further comprising
a holder that holds the first substrate, wherein
while the first substrate is not held by the holder, the deformer deforms the holder from a first state to a second state that is more deformed than the first state, and
while the first substrate is held by the holder, the deformer reduces the amount of the deformation of the holder to less than the amount of the deformation of the second state to deform the first substrate.
3. The substrate bonding apparatus as set forth in claim 2 , wherein
the holder is returned to the first state by the deformer after holding the first substrate.
4. The substrate bonding apparatus as set forth in claim 2 , wherein
the first state is a state in which a holding surface of the holder is flat.
5. The substrate bonding apparatus as set forth in claim 2 , wherein
the holder includes a holding surface having a curved section that is curved with a predetermined curvature, and
the deformer deforms the first substrate in an amount of the deformation in accordance with an amount of the correction of the misalignment by holding the first substrate on the holding surface.
6. The substrate bonding apparatus as set forth in claim 5 , wherein
the deformer deforms the first substrate by deforming the holder in such a manner that the curvature of the curved section varies while the first substrate is held on the holding surface.
7. The substrate bonding apparatus as set forth in claim 2 , wherein
the holder is divided into a plurality of regions and the deformer independently deforms the regions from each other.
8. The substrate bonding apparatus as set forth in claim 2 , wherein
the bending rigidity of the holder is higher than the bending rigidity of the first substrate.
9. The substrate bonding apparatus as set forth in claim 2 , wherein
the holder is a substrate holder that moves together with the first substrate.
10. The substrate bonding apparatus as set forth in claim 9 , wherein
the substrate holder holds the first substrate through electrostatic attraction.
11. The substrate bonding apparatus as set forth in claim 9 , comprising
a support that supports the substrate holder, wherein
the support is deformed by the deformer and the substrate holder is deformed by the deformation of the support.
12. The substrate bonding apparatus as set forth in claim 11 , wherein
the bending rigidity of the support is higher than the sum of the bending rigidity of the first substrate and the bending rigidity of the substrate holder.
13. The substrate bonding apparatus as set forth in claim 11 , wherein
the deformer includes a plurality of actuators that are driven to apply a deforming force to the support and a plurality of elastic members that couple the respective ones of the actuators to the support, and
each of the elastic members is elastically deformed in a direction orthogonal to a driven direction of the actuators while passing a driving force in the driven direction.
14. The substrate bonding apparatus as set forth in claim 11 , wherein
the deformer includes a plurality of actuators that are driven to apply a deforming force to the support and a plurality of couplers that couple the respective ones of the actuators to the support, and
each of the couplers is slidably coupled to at least one of the support and a corresponding one of the actuators, in a direction orthogonal to a driven direction of the actuators.
15. The substrate bonding apparatus as set forth in claim 2 , wherein
the deformer includes a plurality of actuators that are driven to apply a deforming force to the holder.
16. The substrate bonding apparatus as set forth in claim 2 , further comprising
an aligner that aligns the two substrates, wherein
when misalignment equal to or more than a threshold value remains between the two substrates that have been aligned by the aligner, the deformer deforms the holder.
17. The substrate bonding apparatus as set forth in claim 2 , further comprising
a transporter that transports the holder holding the first substrate deformed by the deformer to the bonder while the first substrate remains deformed.
18. The substrate bonding apparatus as set forth in claim 1 , wherein
the amount of the deformation achieved by the deformer is associated in advance with the amount of the correction of the misalignment, and the deformer achieves the deformation the amount of which is determined in accordance with the amount of the correction of the misalignment.
19. The substrate bonding apparatus as set forth in claim 1 , wherein
the deformer deforms the first substrate by bending the first substrate and deforms the second substrate by bending the second substrate in a complementary manner to the first substrate, and
the bonder bonds the first substrate to the second substrate while the first and second substrates both remain bent.
20. The substrate bonding apparatus as set forth in claim 19 , wherein
the deformer deforms in a concave manner a central portion of a to-be-bonded surface of the first substrate and deforms in a convex manner a central portion of a to-be-bonded surface of the second substrate.
21. The substrate bonding apparatus according to claim 1 , wherein the deformer is further operable to bend at least the first substrate of the two substrates in order to change a magnification ratio of the first substrate in accordance with the calculated amount of misalignment between the two substrates.
22. A substrate bonding apparatus comprising:
a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
a deformer operable to deform at least a first substrate of the two substrates in accordance with the calculated amount of misalignment between the two substrates;
a holder that holds the first substrate in a state where the misalignment is correct through deformation by the deformer;
a transporter that transports the holder holding the first substrate in a state where the misalignment is corrected from a position at which the first substrate is held by the holder; and
a bonder operable to bond the first substrate that has been transported by the transporter to the second substrate.
23. The substrate bonding apparatus according to claim 22 , wherein the deformer is further operable to change a magnification ratio of at least the first substrate of the two substrates in accordance with the calculated amount of misalignment between the two substrates.
24. A substrate holding apparatus comprising:
a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
a holder that holds a first substrate of the two substrates to be bonded to a second substrate of the two substrates; and
a deformer that deforms the first substrate while being held by the holder by bending the first substrate in order to correct the calculated amount of misalignment between the first substrate and the second substrate.
25. The substrate holding apparatus according to claim 24 , wherein the deformer deforms the first substrate while being held by the holder by changing a magnification ratio of the first substrate in order to correct the calculated amount of misalignment between the first substrate and the second substrate.
26. A substrate holding apparatus comprising:
a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
a holder operable to hold a first substrate of the two substrates to be bonded to a second substrate of the two substrates; and
a deformer operable to deform the first substrate by bending the first substrate in order to correct the obtained amount of misalignment between the first substrate and the second substrate.
27. A substrate bonding apparatus comprising:
the substrate holding apparatus as set forth in claim 26 ; and
a bonder operable to bond the first substrate in which the misalignment is corrected based on deformation by the deformer to the second substrate.