Patent Assignment
Reel/Frame 031674/0845
Assignment of Assignor's Interest
Recorded: 2013-11-26
Pages: 4
Assignors
KITO, YOSHIAKI
Executed: 2013-11-06
SHIRASU, HIROSHI
Executed: 2013-11-06
YOSHIHASHI, MASAHIRO
Executed: 2013-11-06
YUKI, DAISUKE
Executed: 2013-11-11
SUZUKI, KAZUHIRO
Executed: 2013-11-06
SUGAYA, ISAO
Executed: 2013-11-07
Assignee
NIKON CORPORATION
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus, Substrate Holding Apparatus, Substrate Bonding Method, Substrate Holding Method, Multilayered Semiconductor Device, and Multilayered Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.