Patent Assignment
Reel/Frame 033995/0596
Assignment of Assignor's Interest
Recorded: 2014-10-21
Pages: 2
Assignor
PHILLIPS, ALTON H.
Executed: 2014-10-20
Assignee
NIKON CORPORATION
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN
Covered Property
(1)
Wafer Bonding System and Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.