Patent Assignment
Reel/Frame 029267/0029
Assignment of Assignor's Interest
Recorded: 2012-11-08
Pages: 2
Assignee
NIKON CORPORATION
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN
Covered Property
(1)
Substrate Separating Apparatus, Load Lock Apparatus, Substrate Bonding Apparatus, Substrate Separating Method, and Manufacturing Method of a Semiconductor Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.